STIRRI™
STIRRI-LT-HF Sn42Bi57.6Ag0.4 (T4) low-temp rosin solder paste 87% powder load 0.4% silver no-clean lead-free halogen-free (ROL0)
STIRRI-LT-HF Sn42Bi57.6Ag0.4 (T4) low-temp rosin solder paste 87% powder load 0.4% silver no-clean lead-free halogen-free (ROL0)
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Printer Operation
The following are general guidelines for stencil printer optimization with StirriLtºHF (some adjustments may be necessary based on your process requirements)
Print Speed: 25-125 mm/sec
Squeegee Pressure: 70-250g/cm of blade
Under Stencil Wipe: Once every 10-25 prints, or as necessary
Powder Distribution
| Micon Size | Type | Pitch Requirements |
| 45 - 75μm | Type-2 | 24 mil and above |
| 25 - 45μm | Type-3 | 16 - 24 mil |
| 20 - 38μm | Type-4 | 12 - 16 mil |
| 15 - 25μm | Type-5 | 8 - 12 mil |
| 5 - 15μm | Type-6 | 5 - 8 mil |
| 2 - 11μm | Type-7 | < 5 mil |
Note: Type-6 and Type-7 may not be available in certain alloys. Other powder distributions are available on request.
Stencil Life
>12 hours @ 30-45% RH and 20-25°C
~ 4 hours @ 45-75% RH and 20-25°C
Cleaning
No-clean solder paste does not require cleaning for most SMT assemblies.
Storage
Solder paste should be stored between 3-8°C (37-46°F) to obtain the maximum refrigerated shelf life of six months. Unopened solder paste stored at room temperature, 25°C (77°F) will have a one month shelf life. Syringes and cartridges should be stored vertically in the refrigerator with the dispensing tip down.
Allow 4-8 hours for solder paste to reach optimal operating temperature of 20-25°C (68-77°F). Keep the solder paste container sealed while warming the solder paste to operating temperature.
NEVER FREEZE SOLDER PASTE!
